main site    description    materials    links		Contact and packaging technology for SiC devices designed for high temperature, high power and high frequency applications. Institution: Institute of Micro- i Optoelectronics, Warsaw University of Technology Leader: dr inż. Ryszard Kisiel Contribution to the project: technology of ohmic contacts to SiC being able to work stable in the elevated temperature conditions, technology of electric interconnections for packaging of SiC devices suitable for the devices operating in the elevated temperature conditions.

Department of Semiconductor and Optoelectronics Devices