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Contact and packaging technology for SiC devices designed for high temperature, high power and high frequency applications.

Institution: Institute of Micro- i Optoelectronics, Warsaw University of Technology

Leader: dr in┐. Ryszard Kisiel

Contribution to the project:
  • technology of ohmic contacts to SiC being able to work stable in the elevated temperature conditions,

  • technology of electric interconnections for packaging of SiC devices suitable for the devices operating in the elevated temperature conditions.

Department of Semiconductor and Optoelectronics Devices