Contact and packaging technology for SiC devices designed for high temperature, high power and high frequency applications.
Institution: Institute of Micro- i Optoelectronics, Warsaw University of Technology
Leader: dr in┐. Ryszard Kisiel
Contribution to the project:
- technology of ohmic contacts to SiC being able to work stable in the elevated temperature conditions,
- technology of electric interconnections for packaging of SiC devices suitable for the devices operating in the elevated temperature conditions.